PURPOSE: To make it possible to mount a substrate with high reliability and carry out a visual test in automatic mode after the substrate is mounted by installing a groove or a dent on the front surface or the rear surface of a cut solid piece of an outer lead of a lead frame.

CONSTITUTION: A groove 4, for example, one with a U-shaped cross section is installed to the rear surface of a solid cut piece of a semiconductor device 1 of a whole outer lead 3a for a lead frame 2 which holds a dam bar 8, which connects the plurality of leads and the outer peripheral part of the plurality of leads. The solid cut pieces, which are located, start from the root of the outer lead 3a of a device body 15 and separated from the tip 3b of the outer lead by extension length in the shape of the outer lead. The groove section 4 is bonded with solder 7. Therefore, the lead tip 3b is also bonded with solder 10, which prevents solder strength from being degraded. Furthermore, they are soldered more definitely during the substrate is mounted, which makes it possible to carry out a visual test of soldering in automatic mode.