Title:
LEAD FRAME AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0555431
Kind Code:
A
Abstract:
PURPOSE: To provide a lead frame in which a remaining sticking to the side end of an external terminal can be reduced when a semiconductor chip placed on a die stage is resin-molded to form a package.
CONSTITUTION: In a lead frame formed by coupling external terminals 11 sealed at one end with a resin-molded package 52 to a tie bar 13, an extension plate 21 which is extended to the side of the package and a region surrounded by adjacent external terminals and in which the side of the package and the adjacent external terminals are separated therebetween by a slit-like cutout 22, is provided at the tar for connecting the adjacent terminals 11 to form the lead frame.
Inventors:
ANDO CHITOSHI
Application Number:
JP21495091A
Publication Date:
March 05, 1993
Filing Date:
August 27, 1991
Export Citation:
Assignee:
FUJITSU LTD
KYUSHU FUJITSU ELECTRONIC
KYUSHU FUJITSU ELECTRONIC
International Classes:
H01L23/28; H01L23/50; (IPC1-7): H01L23/28; H01L23/50
Attorney, Agent or Firm:
Teiichi
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