PURPOSE: To contrive not to generate the slippage of the bonding wires at the time of connection, to reduce the possibility of shortcircuiting between the wires and their adjacent wires and to improve the yield of produce assembly by a method wherein most of the cut surfaces of the point parts of the inner leads are formed almost at right angle to the extension directions of their respective bonding wires.

CONSTITUTION: Points 1 of inner leads are made so as to be formed almost at right angle to the extension directions of their respective bonding wires 4. 2 shows a semiconductor element, 3 an electrode of the semiconductor element and 5 the ridge line of the cut surface of the point of each lead. By forming the points 1 of the inner leads almost at right angle to the extension directions of their respective bonding wires 4 in such a way, the inner leads are never subjected to the effect of the ridge lines 5 of their cut surfaces. As a result, the slippage of the bonding wires 4 is never generated, the possibility of shortcircuiting between the bonding wires 4 and their adjacent bonding wires is also reduced and the yield of product assembly can be improved.