PURPOSE: To increase the positioning accuracy of the chip as well as to eliminate the breaking of soldering for the subject lead frame by a method wherein gold or gold alloy or other metal alloy, with which a frame and a chip will be welded, is coated in advance on the mounting surface of the semiconductor chip of the lead frame.

CONSTITUTION: A copper or nickel film 202 is coated on the semiconductor chip mounting surface of the material 201 of the lead frame for semiconductor consisting of iron, copper or the alloy of these metals by performing plating. Then, a copper or nickel film 207 is provided at the chip adhering position on the film 202, and gold or gold alloy or other metal alloy 208 is coated on the film 207 in advance. If the solder 208 is provided as above, the chip can be adhered with an excellent positioning accuracy, and the quality of products can also be improved without having a breaking of soldering.