To design a lead frame which is capable of reducing the outer burrs of a semiconductor package and better dissipating heat.

A lead frame is equipped with a packaging region 150, a die pad 110 located in the packaging region 150, leads provided surrounding the die pad 110 so as to be partially arranged in the packaging region 150, a heat slug 200 located outside the packaging region 150, and tie bars 120, in which one of the tie bars 120 is attached to the die pad 110 so as to connect the die pad 110 to the heat slug 200.