Title:
リードフレーム
Document Type and Number:
Japanese Patent JP7027983
Kind Code:
B2
Abstract:
To provide a lead frame joining two kinds of frame of different thickness, in which the part to be truncated later is reduced.SOLUTION: A lead frame 40 is used for manufacturing a semiconductor device 2 where semiconductor chips 3-6 fixed to heat slingers 12, 22 are encapsulated in a resin package 9, a power terminal 14 conducting with the semiconductor chip is extending from one face of the resin package 9, and a control terminal 15 conducting with the semiconductor chip is extending from the opposite face. The lead frame 40 includes first and second frames 42, 43 thinner than the heat slingers 12, 22. The first frame 42 is supporting the power terminal 14 and joined to the heat slingers 12, 22. The second frame 43 is supporting the control terminal 15, and located on the opposite side to the first frame 42, when viewing from the normal direction to the heat slingers 12, 22, and bonded thereto.SELECTED DRAWING: Figure 5
Inventors:
Hirotaka Ohno
Takayuki Furuhata
Takanori Kawashima
Takayuki Furuhata
Takanori Kawashima
Application Number:
JP2018047522A
Publication Date:
March 02, 2022
Filing Date:
March 15, 2018
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L23/48; H01L23/29; H01L23/50; H01L25/07; H01L25/18
Domestic Patent References:
| JP201692166A | ||||
| JP201098165A | ||||
| JP201436077A | ||||
| JP201453461A |
Attorney, Agent or Firm:
Kaiyu International Patent Office
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