Title:
LEAD FRAME
Document Type and Number:
Japanese Patent JPH06163796
Kind Code:
A
Abstract:
PURPOSE: To form a lead frame for fabricating an integrated circuit package with a shield by the fabrication process which is also used for fabricating an ordinary plastic package having no shield.
CONSTITUTION: A lead frame 1 is integrated with a loaded integrated circuit chip by a molding resin to become a part of an integrated circuit package. Plate portions 14a are formed along at least one side surface of the completed package to form an electromagnetic shield.
Inventors:
KURASHIMA HIROMI
TAKAHASHI HISATO
TAKAHASHI HISATO
Application Number:
JP33805392A
Publication Date:
June 10, 1994
Filing Date:
November 25, 1992
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/50; H05K9/00; (IPC1-7): H01L23/50; H05K9/00
Attorney, Agent or Firm:
Takashi Koshiba