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Patent Searching and Data


Title:
LEAD-FREE ALLOY SOLDER
Document Type and Number:
Japanese Patent JP2007015012
Kind Code:
A
Abstract:

To provide an effective adhering method using lead-free metal for the adhesion of glass or the like regarding a technical art for producing pair glass, a cathode-ray tube, a vacuum vessel or a gas sealing vessel where the sealing part of glass is subjected to sealing with lead-free alloy solder.

The lead-free alloy solder 3 has a componential composition composed of a zinc component by 94 to 62%, a tin component by 31 to 15%, an aluminum component by 3 to 6%, and a silver component by 0.5 to 1%. Each glass 1, 2 is superposed, heated at 320 to 360°C, and sealed using the above solder, so as to produce a glass vessel.


Inventors:
YAMADA MINORU
Application Number:
JP2005224651A
Publication Date:
January 25, 2007
Filing Date:
July 05, 2005
Export Citation:
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Assignee:
SOPHIA PRODUCT KK
International Classes:
B23K35/28; C03C27/06; C22C18/00