Title:
非鉛系接合材、ソルダーペースト及び接合方法
Document Type and Number:
Japanese Patent JP4112946
Kind Code:
B2
Abstract:
A lead-free joining material includes zinc and tin as major components, and at least any one of bismuth and germanium as an additive element. The joining material includes a core part, and a surface layer covering the core part. The surface layer includes a solid-solution phase which contains the tin as a main component and a needle crystal which is dispersed in the solid-solution phase and contains the zinc as a main component. Moreover, a concentration of the additive in the solid-solution phase is higher than a concentration of the additive element in the core part, and the concentration of the additive element in the solid-solution phase is in a range of 0.6 to 4.0% by weight.
Inventors:
Tadauchi Hitoshi
Komatsu
Kazutaka Matsumoto
Isao Suzuki
Yuko Imamura
Komatsu
Kazutaka Matsumoto
Isao Suzuki
Yuko Imamura
Application Number:
JP2002318817A
Publication Date:
July 02, 2008
Filing Date:
October 31, 2002
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
B23K3/00; B23K35/26; B23K35/02; B23K35/22; C22C13/00; H05K3/34
Domestic Patent References:
| JP2000107882A | ||||
| JP2002248596A | ||||
| JP2002273596A |
Attorney, Agent or Firm:
Mitsuyuki Matsuyama
Tetsuma Ikegami
Akira Sudo
Hiroshi Horiguchi
Tetsuma Ikegami
Akira Sudo
Hiroshi Horiguchi
Previous Patent: JPH04112945
Next Patent: SENSOR FAILURE JUDGING METHOD FOR INTERNAL COMBUSTION ENGINE CONTROLLER
Next Patent: SENSOR FAILURE JUDGING METHOD FOR INTERNAL COMBUSTION ENGINE CONTROLLER