PURPOSE: To form the titled parts which can flatly be mounted onto a main printed substrate of an electronic device and enable the thinning of the electronic device by a method wherein a conductive wiring is led out to a surrounding part of the substrate, and thin film-shaped external terminals are made up to the surrounding part.

CONSTITUTION: Printed wirings are led out to the surrounding part of the insulating substrate 1 for connection to an external circuit, and metallic thin film-shaped external terminals having an excellent soldering property are formed to the part. The external terminals 8' are made up to ensure that they extend on the back through an end surface from an upper surface of a fringe part of the insulating substrate 1. Or the external terminals 8" are formed only at the upper surface side of the fringe part of the insulator, and U-shaped or ringed metal fittings, whose one part is notched, are fitted to the external terminals 8" by utilizing their elasticity when fixing the terminals to a main printed board. Thus, the external terminals are flatly mounted onto the main printed substrate, and the electronic device can be thinned as a whole.