Title:
LEAD LINE ARRAY CONNECTOR
Document Type and Number:
Japanese Patent JPH05242941
Kind Code:
A
Abstract:
PURPOSE: To ensure a clear and simple demounting from a connecting position by connecting a first connecting element for a lead line array to a second connecting element via a printed board, and connecting a connecting element for another lead line array connector to an unconnected first connecting element. CONSTITUTION: One of first connecting elements 1 is connected to one of a bundle of second connecting elements 3. To the element 3 a bundle plug 5 can be connected, and also a flat plug can be connected thereto if circumstances require. The printed board 4 can gather and bundle lead wires extending from a plurality of elementary parts 7 which are put side by side and equipped the connecting elements 1 and connecting elements to a cross connector 10. The elements 3 are bundled at one position in the printed board 4 and let out to the bundle plug 5. The elements 11 are brought into contact with the cross connector 10. The elements 1 which are not connected to the elements 3 are connected to the connecting elements 11 to the cross connectors 10. The elements 1 which are not connected to the elements 3 are connected to the connecting elements 11 to the cross connector 10. The connector 10 is maintained as a bus bar in an insulator 13 in a supporting rail 12.
Inventors:
YOHAN HERUMAN
Application Number:
JP29793092A
Publication Date:
September 21, 1993
Filing Date:
October 09, 1992
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H01R9/26; H01R12/71; H01R41/00; (IPC1-7): H01R41/00; H01R9/26; H01R23/68
Attorney, Agent or Firm:
Tomimura Kiyoshi