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Title:
LEAD LINEAR LIGHT SOURCE AND BACKLIGHT
Document Type and Number:
Japanese Patent JP2012119436
Kind Code:
A
Abstract:

To obtain an LED linear light source which exhibits high heat dissipation and also can reduce the amount of warp, and a backlight using the LED linear light source.

An LED linear light source (1, 100, 200) of the prevent invention comprises: a slender metal base substrate (10); a plurality of LED chips (6) mounted in a row on the metal base substrate (10); and a light-transmissive encapsulation resin (8) covering the LED chips (6). The encapsulation resin (8) constitutes island-shaped sealing parts (20) which are disposed in shape of islands and at an equal pitch on a laminate structure layer along the longer direction of the metal base substrate (10), each of the island-shaped sealing parts (20) covering an LED chip group (16, 216) composed of a conductive foil layer (13) and a plurality of electrically connected LED chips (6) and being secured to a heat radiation member with a screw (2) of a between-island part (30). This construction helps to prevent a warp in the LED linear light source.


Inventors:
KOBAYASHI NOBUYUKI
Application Number:
JP2010266836A
Publication Date:
June 21, 2012
Filing Date:
November 30, 2010
Export Citation:
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Assignee:
STANLEY ELECTRIC CO LTD
International Classes:
H01L33/62; F21S2/00; F21V19/00; F21V29/00; F21Y101/02
Domestic Patent References:
JP2009081195A2009-04-16
JP2010258403A2010-11-11
JP2010129598A2010-06-10
JP2005032649A2005-02-03
JP2009224486A2009-10-01
JP2009081196A2009-04-16
JP2008288457A2008-11-27
Foreign References:
WO2008132941A12008-11-06