Title:
LEAD SHAPING AND LEAD SHAPING APPARATUS
Document Type and Number:
Japanese Patent JP2536411
Kind Code:
B2
Abstract:
PURPOSE: To improve flatness individual leads and prevent uneveness of lead edges in the reference plane.
CONSTITUTION: Under the condition that a package 3 is fixed with an upper die 5 and a lower die 1, both lead shaping dies 6, 7 are moved respectively in the directions of arrow marks A and B. Thereby, the groove walls at the edges of both lead shaping dies 6, 7 first hit a lead 4b which is deformed to be floated from the reference plane P. When the lead 4b is moved while it is deformed, the normal lead 4a is also deformed and stops at the position where an angle θ2 formed by the actually loading side surface 4c of the edge portion of the lead 4 as a whole and the reference plane P becomes equal. In this case, the edge of lead 4 is corrected by the groove walls of the lead shaping dies 6, 7 and the lead edge is shaped to correct the flatness under the condition that individual lead edges are set in order. After this condition is maintained for the predetermined period, the pressing operation by both lead shaping dies 6, 7 can be cancelled.
Inventors:
IKEDA FUMIMARO
Application Number:
JP16483693A
Publication Date:
September 18, 1996
Filing Date:
July 02, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
B21F1/00; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP2272752A |
Attorney, Agent or Firm:
Wakabayashi Tadashi