Title:
LEAD WIRE CONNECTION STRUCTURE TO PRINTED BOARD
Document Type and Number:
Japanese Patent JP3278737
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a structure in which a lead wire can be positioned and attitude-held in soldering the lead wire to a printed board.
SOLUTION: A structure comprises an insulation body 7 to be installed on a printed board 1 which is provided with a hole 8 to which the printed board 1 is inserted, a window part 9 in which an electrode of the inserted printed board 1 is exposed, a hole 10 to which a lead wire 4 is inserted as a coating 6 is peeled to expose a core wire 5, and a stopper part 11 to position-regulate the lead wire 4 to put the core wire 5 right above the electrode of the printed board 1 when it is inserted. As the printed board 1 is inserted into the hole 8 in the insulation body 7, with the lead wire 4 inserted from the hole 10, it is positioned at the place where the core wire 5 is applied to the stopper part 11, and a part to be soldered is exposed through the window part 9. A tool is then inserted into the window part 9 for soldering.
Inventors:
Kazuo Muramatsu
Hiroshi Sano
Takayuki Yamawaki
Nobutake Matsushita
Hiroshi Sano
Takayuki Yamawaki
Nobutake Matsushita
Application Number:
JP30071495A
Publication Date:
April 30, 2002
Filing Date:
October 25, 1995
Export Citation:
Assignee:
Minebea Co., Ltd.
International Classes:
H05K1/18; H05K3/34; (IPC1-7): H01R12/04; H05K1/18
Domestic Patent References:
| JP593069U |
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)