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Patent Searching and Data


Title:
LEAD WIRE
Document Type and Number:
Japanese Patent JPH10233121
Kind Code:
A
Abstract:

To improve respective property of separation resistance, soldering, discolor resistance and migration resistance without using silver plating, by applying nickel plating to a base layer, nickel allay plating to an intermediate later, and noble metal plating to the outermost layer as plating applied onto a core wire conductor.

Nickel plating 11 is applied as a base layer over the whole surface on a conductor 10, composed of a copper-coated steel wire wherein copper and copper alloy are coated onto a copper, copper alloy, or steel wire; and nickel alloy plating 12 as an intermediate layer, and moreover noble metal plating 13 as the outermost layer are applied onto the base layer and the intermediate layer respectively. The nickel alloy plating is preferably one of nickel- phosphorus alloy plating, nickel-boron alloy plating, nickel-cobalt alloy plating, nickel-cobalt-phosphorus alloy plating, nickel-cobalt-boron alloy plating, nickel- palladium alloy plating, and nickel-palladiumphosphorus alloy plating.


Inventors:
AKINO HISANORI
CHINDA SATOSHI
SHIGETA YUICHI
KOMATSU KATSUJI
YASHIRO SEIJI
Application Number:
JP3345797A
Publication Date:
September 02, 1998
Filing Date:
February 18, 1997
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
C25D7/06; H01B5/02; (IPC1-7): H01B5/02; C25D7/06
Attorney, Agent or Firm:
Tadao Hirata