Title:
LEAF THICKNESS MEASUREMENT APPARATUS
Document Type and Number:
Japanese Patent JP3498916
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a leaf thickness measurement apparatus capable of exactly measuring the thickness of a leaf without giving an evil effect to the tissue of leaf of plants as a living body and without damaging the function of the leaf including photosynthesis.
SOLUTION: The device comprises at least a pair of sensor head 2 arranged facing to each other with a gap and pinching a leaf blade 1 in between by noncontact, and a drive operator 4 for driving the sensor head and operating the gap between the sensor head and the front surface and the back surface of the leaf blade from its output. The sensor head 2 is constituted of an LED 2a emitting light with a constant wavelength in pulse, a condensing leans 2b condensing the pulse light to a specific spot point on the head front, and a photodiode 2c for detecting the intensity of reflection light from the spot point.
Inventors:
Hitoshi Suzuki
Yoda Kiyotsune
Goto Tomoko
Yoda Kiyotsune
Goto Tomoko
Application Number:
JP2001173331A
Publication Date:
February 23, 2004
Filing Date:
June 08, 2001
Export Citation:
Assignee:
RIKEN
International Classes:
G01B11/06; (IPC1-7): G01B11/06
Domestic Patent References:
| JP9273912A | ||||
| JP5118823A |
Attorney, Agent or Firm:
Minoru Hotta
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