Title:
LED LIGHT-EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2011134902
Kind Code:
A
Abstract:
To provide an LED light-emitting device having superior heat dissipation efficiency.
As shown in Fig 1, the LED light-emitting device includes two lead frames 10a, 10b on a positive electrode side and a negative electrode side; a case 11; face-up type LED chips 12a, 12b; and a sealing resin 13. The two lead frames 10a, 10b are the same in area. The LED chips 12a, 12b are, respectively mounted on the lead frames 10a, 10b. The surfaces (rear surface) on the opposite side of the mounting side of the LED chips 12a, 12b in the two lead frames 10a, 10b are exposed from the case 11. The heat of the LED chips 12a, 12b is radiated from the both rear surfaces of the lead frames 10a, 10b, thereby obtaining superior heat dissipation efficiency.
Inventors:
DEMUKAI YUKIHIRO
HAYASHI TOSHIMASA
KOKUBU HIDEKI
FUKUI YASUO
HAYASHI TOSHIMASA
KOKUBU HIDEKI
FUKUI YASUO
Application Number:
JP2009293232A
Publication Date:
July 07, 2011
Filing Date:
December 24, 2009
Export Citation:
Assignee:
TOYODA GOSEI KK
International Classes:
H01L33/64
Domestic Patent References:
| JP2002314138A | 2002-10-25 | |||
| JP2008244143A | 2008-10-09 | |||
| JP2004055529A | 2004-02-19 | |||
| JP2004342472A | 2004-12-02 | |||
| JP2007288198A | 2007-11-01 | |||
| JP2008244357A | 2008-10-09 | |||
| JP2007180320A | 2007-07-12 |
Foreign References:
| WO2008081696A1 | 2008-07-10 | |||
| WO2009016913A1 | 2009-02-05 | |||
| WO2009119461A1 | 2009-10-01 |
Attorney, Agent or Firm:
Osamu Fujitani