LED PACKAGE AND LED LIGHTING DEVICE

Title:

LED PACKAGE AND LED LIGHTING DEVICE

Document Type and Number:

Japanese Patent JP2012190841

Kind Code:

A

Abstract:

To realize an LED package and an LED lighting device which efficiently radiate heat generated from an LED chip, improve the reliability, and achieve the size increase.

An LED package 100 includes: an LED chip 110; a supporting body 120 supporting the LED chip 110 on a placement surface 120a and formed of a ceramic; a metal film for heat radiation 130 formed on a rear surface 120b of the supporting body 120 and electrically insulated from a wiring pattern 160 on a circuit board 170; and conductor wirings 140 and 150 electrically connecting the LED chip 110 installed in the supporting body 120 with the circuit body 170. The metal film for the heat radiation 130 thermally connects the rear surface 120b of the supporting body 120 with the circuit board 170.

Inventors:

SEKI NORIAKI
BEPPU FUMIAKI
NAGAE TAKAHARU
KUMEDA KAZUTETSU
SUGI HIROFUMI
TODAKA HIDEYUKI
FUJIMARU TAKUYA
NIINA NORIYUKI

Application Number:

JP2011050570A

Publication Date:

October 04, 2012

Filing Date:

March 08, 2011

Export Citation:

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Assignee:

PANASONIC CORP

International Classes:

H01L33/64; F21V29/00

Domestic Patent References:

JP2004022802A	2004-01-22
JP2007300111A	2007-11-15
JPS63107483U	1988-07-11
JP2011009143A	2011-01-13
JP67109254A
JP2007165937A	2007-06-28
JP2006245032A	2006-09-14
JP2007300111A	2007-11-15

Foreign References:

WO2010150754A1	2010-12-29
WO2008105527A1	2008-09-04

Attorney, Agent or Firm:

鷲田公一

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