Title:
LED PRINTER HEAD
Document Type and Number:
Japanese Patent JPS63236376
Kind Code:
A
Abstract:
PURPOSE:To simplify a manufacturing process, facilitate the replacement of defective portions, and improve on the yield by a method wherein a metal film is attached to the rear side of a LED chip and the LED chip is installed to a substrate with solder. CONSTITUTION:A solder paste 5 is applied to a location for an LED chip 3 on a substrate 1 and the LED chip 3 is provisionally attached to said location. A solder bump 4 is pasted at a location for a driver chip 2 and the driver chip 2 is provisionally attached to said location. The entirety is heated in a continuous furnace, whereby the driver chip 2 and LED chip 3 are soldered to the substrate for the establishment of connection. During this process, the solder bump 4 and solder paste 5 prevent the driver chip 2 and LED chip 3, respectively, from moving from the prescribed locations. After the connection of the driver chip 2 and LED chip 3 to the substrate 1 with solder, the LED chip 3 and a wiring pattern 1a belonging in the substrate 1 are connected by a gold wire 6. This greatly reduces the manhours demanded in the manufacturing process.
Inventors:
SAKASHITA YASUYUKI
MEGO KAZUYOSHI
MEGO KAZUYOSHI
Application Number:
JP6883987A
Publication Date:
October 03, 1988
Filing Date:
March 25, 1987
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B41J2/44; B41J2/45; B41J2/455; H01L33/08; H01L33/62; (IPC1-7): B41J3/21; H01L33/00
Attorney, Agent or Firm:
Katsuo Ogawa
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