Title:
LID MATERIAL
Document Type and Number:
Japanese Patent JP3634474
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form an ultra-thin film layer with good flexibility and ductility on a backing film and to use the layer as a combustion improver in the incineration of refuse by forming a barrier layer consisting of two silicon oxide layers which are prepared in sequence by chemical vapor deposition and physical vapor deposition at least on one side of a backing film.
SOLUTION: A lid material has two SiOx layers 2 made from oxygen and silicon at least on one side of a backing film 1. The first layer which contacts the backing film directly is a vapor deposition layer 21 of SiOx (x=1-2) which has good adhesion and flexibility and is prepared by a chemical vapor deposition method, the second layer is a vapor deposition layer 22 of SiOx (x=1-2) which has good post-processability and is prepared by a physical vapor deposition method, and the two layers are laminated. Also, it is composed of a laminated film of an easily peelable heat seal resin layer and a vapor deposition film. The light transmittance of the SiOx layer is at least 90%. The SiOx layer 2 is coated with the easily peelable heat seal resin layer 76 by melt extrusion.
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Inventors:
Takanori Ohboshi
Application Number:
JP32353895A
Publication Date:
March 30, 2005
Filing Date:
November 20, 1995
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B65D43/00; B32B9/00; B32B27/00; B32B27/06; C23C14/10; C23C28/04; (IPC1-7): B32B9/00; B32B27/00; B32B27/06; B65D43/00; C23C14/10; C23C28/04
Domestic Patent References:
| JP5345383A | ||||
| JP7032531A | ||||
| JP4089236A | ||||
| JP6286765A | ||||
| JP9123334A | ||||
| JP4115940A |
Attorney, Agent or Firm:
Satoshi Kanayama
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