Lid material - DYNIC CORPORATION

Title:

Lid material

Document Type and Number:

Japanese Patent JP6264359

Kind Code:

B2

Abstract:

This lid has at least a substrate layer, an anchor coat layer, a stress relaxation layer, and a hot-melt adhesive layer, and has a structure obtained by layering said layers in this order. The hot-melt adhesive that constitutes the hot-melt adhesive layer contains 20-50 mass% of an ethylene-vinyl acetate copolymer as a component (A), and relative to 100 parts by mass of the ethylene-vinyl acetate copolymer constituting the component (A), also contains 8-80 parts by mass of an adhesiveness-imparting agent as a component (B), 85-230 parts by mass of a wax as a component (C), and 15-200 parts by mass of talc as a component (D).

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Inventors:

Shinji Misawa
Ken Nakajima
Keigo Kurita
Kenji Ishiguro
Sho Hikasa

Application Number:

JP2015228815A

Publication Date:

January 24, 2018

Filing Date:

November 24, 2015

Export Citation:

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Assignee:

DYNIC CORPORATION

International Classes:

B65D77/20; B32B27/00; B32B27/20; B32B27/28; C09D5/00; C09D201/00; C09J11/04; C09J11/06; C09J11/08; C09J123/08; C09J131/04

Domestic Patent References:

JP10156995A
JP2011156822A
JP2013116745A
JP11333964A

Attorney, Agent or Firm:

Taji U.S. Patent Office

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