Title:
発光部品実装装置および発光部品実装方法
Document Type and Number:
Japanese Patent JP7178541
Kind Code:
B2
Abstract:
A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.
Inventors:
Hideaki Kato
Koji Sakurai
Masanori Ikeda
Naoki Azuma
Koji Sakurai
Masanori Ikeda
Naoki Azuma
Application Number:
JP2018019714A
Publication Date:
November 28, 2022
Filing Date:
February 07, 2018
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05K13/04; H05K13/08
Domestic Patent References:
JP2015159285A | ||||
JP2016100379A | ||||
JP2015233121A | ||||
JP2017139388A | ||||
JP2000286452A | ||||
JP8018164A |
Attorney, Agent or Firm:
Kenji Kamata
Koichi Nomura
Koichi Nomura