To provide a light emitting device which is improved in heat dissipative property and suppresses a decrease in light emission efficiency.

The light emitting device includes a light emitting element 3 and a substrate 1 which has a conductor 2 electrically connected to the light emitting element 2 and is provided with a through-hole (cut) 1a vertically penetrating the substrate in plan view, wherein the light emitting element 3 is disposed so as to close at least part of the through-hole (cut) 1a when the substrate is viewed in a plan. The light emitting device is characterized in that the light emitting element 3 is sealed with a light transparent member 6. Further, the light emitting device is characterized in that conductors 2 are disposed on both sides of a through-hole (cut) 1a when a substrate 1 is viewed in a plan.