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Title:
LIGHT EMITTING DEVICE PACKAGE
Document Type and Number:
Japanese Patent JP2011254080
Kind Code:
A
Abstract:

To provide a light emitting diode package that can prevent discoloration of a package body and light interference.

A light emitting device package includes a body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the body and spaced apart from each other, a first light emitting element disposed in the first reflective cup, and a second light emitting element disposed in the second reflective cup.


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Inventors:
BONG KUL MIN
Application Number:
JP2011123165A
Publication Date:
December 15, 2011
Filing Date:
June 01, 2011
Export Citation:
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Assignee:
LG INNOTEK CO LTD
International Classes:
H01L33/48; F21S2/00; F21S8/04; F21Y101/02
Domestic Patent References:
JP2006093435A2006-04-06
JPH028070U1990-01-18
JP2010010474A2010-01-14
JP2010003788A2010-01-07
JP2008112966A2008-05-15
JP2008098218A2008-04-24
JP2002314138A2002-10-25
JP2005353914A2005-12-22
JP2007027765A2007-02-01
JP2007095722A2007-04-12
Foreign References:
KR20080085505A2008-09-24
Attorney, Agent or Firm:
Toshihiro Kindaka



 
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