Title:
発光装置
Document Type and Number:
Japanese Patent JP6932019
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a new technique for enhancing luminous efficiency of a light emitting device.SOLUTION: A light emitting device 10 includes: a semiconductor light emitting element 12; a package substrate 14 on which the semiconductor light emitting element 12 is mounted; and a reflecting member 16 that reflects light traveling from the semiconductor light emitting element 12 to the package substrate 14. The reflecting member 16 uses a silicon substrate 50 having rigidity capable of maintaining its shape and, by providing a reflecting layer 52 on the surface, it is made as a separate member.SELECTED DRAWING: Figure 2
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Inventors:
Kenta Ura
Application Number:
JP2017070900A
Publication Date:
September 08, 2021
Filing Date:
March 31, 2017
Export Citation:
Assignee:
NIKKISO CO.,LTD.
International Classes:
H01L33/60; H01L33/48; H01L33/62
Domestic Patent References:
| JP2007266357A | ||||
| JP2017017162A | ||||
| JP2008199000A |
Foreign References:
| WO2016185675A1 | ||||
| US20110248287 | ||||
| KR1020170017150A |
Attorney, Agent or Firm:
Sakaki Morishita