To provide a light emitting diode package in which luminance intensity and visual field distribution can be adjusted easily and, in addition, can be improved in heat radiating efficiency to the maximum by employing a metallic reflecting plate having superior thermal conductivity as a heat sink.

The light emitting diode package includes a first ceramic substrate 101 having an upper surface provided with an LED element mounting area and a prescribed conductive pattern formed around the mounting area, at least one LED element 105 which is arranged on the mounting area on the upper surface of the substrate 101 and connected to the conductive pattern, and a second ceramic substrate 102 which is arranged on the first substrate 101 and has a cavity formed in its area corresponding to the mounting area of the substrate 101. This package also includes a metallic reflecting plate 120 provided in the cavity of the second substrate 102 to surround the LED element 105.