Title:
発光ダイオードパッケージ構造
Document Type and Number:
Japanese Patent JP5574716
Kind Code:
B2
Abstract:
An LED package structure (100) includes a carrier (110), a housing (120), an LED chip (130), an encapsulant (140) and a surface treatment layer (150). The housing is disposed on the carrier and has an upper surface (122), wherein the housing and the carrier together form a chip-containing cavity (C'). The LED chip is disposed on the carrier and located in the chip-containing cavity. The encapsulant is disposed in the chip-containing cavity and encapsulates the LED chip. The surface treatment layer is disposed on the upper surface of the housing to prevent the encapsulant from adhering to the upper surface of the housing.
Inventors:
Circumference 彦甫
Application Number:
JP2010005523A
Publication Date:
August 20, 2014
Filing Date:
January 14, 2010
Export Citation:
Assignee:
100 million photoelectron industrial 股ふん, Inc. Everlight Electronics Co., Ltd.
International Classes:
H01L33/52; H01L23/28
Attorney, Agent or Firm:
Kenji Sugimura
Akito Okura
Jun Araki
Akito Okura
Jun Araki