To provide a light-emitting diode in which electrostatic breakdown prevention functions are provided and a number of pins for providing improved heat radiation effect and illuminance are installed.

At least three pins are provided in the light-emitting diode 20. An electrostatic protective apparatus 37 and at least one emission chip 31 are provided in an installation stand 359. The emission chip 31 is bonded to a electrostatic protective device 37 in a flip-chip system. The first electrode 311 and the second electrode 313 of the emission chip 31 are electrically connected to first protective electrode 371 and the second protective electrode 373 that oppose each other. And at least one radiating pin 355 is provided at the installation stand 359, a first conductive pin 351 and a second one 353 are provided on the side, and the first protective electrode 371 and the second one 373 are electrically connected to the first conductive pin 351 and the second pin 353.