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Title:
LIGHT EMITTING ELEMENT MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2011238787
Kind Code:
A
Abstract:

To provide a method for manufacturing a light emitting element with reduced risk of breakage in an electrode formation step and during handling.

This light emitting element manufacturing method includes a step for forming a crystalline layer including a light emitting layer formed in a split schedule line formed in a lattice shape on a substrate for crystal growth and in each area blocked by the split schedule line; a supporting substrate preparation step for preparing a supporting substrate with a circular indented portion and an annular projecting portion surrounding the circular indented portion; a step for jointing the crystalline layer side of the substrate for crystal growth, on which the crystalline layer is formed, in and opposite to the circular indented portion of the supporting substrate; a step for exfoliating the substrate for crystal growth from the supporting substrate jointed to the substrate for crystal growth and arranging the crystalline layer in the circular indented portion of the supporting substrate; and a step for splitting the supporting substrate along the split schedule line.


Inventors:
NORIMOTO TAKASHI
Application Number:
JP2010109248A
Publication Date:
November 24, 2011
Filing Date:
May 11, 2010
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L33/02; H01L21/301; H01L33/32; H01L33/38
Domestic Patent References:
JP2009231560A2009-10-08
Attorney, Agent or Firm:
Akira Matsumoto
Kenji Ito