To provide a light emitting element package which maximizes light extraction efficiency by allowing light emitted from side surfaces of a chip to be emitted toward an upper part through internal reflection, which realizes light having uniform color quality by a phosphor layer uniformly formed on the upper part of the chip, and to provide a manufacturing method of the light emitting element package.
A light emitting element package may include: multiple lead frames 10 disposed so as to be spaced away from each other; at least one light emitting element 20 which is mounted on the lead frames 10, includes wire bonding pads 23 on the same surface as a light emission surface 21 located on an upper part, and electrically connects with the lead frames 10 through bonding wires 25; a body part 30 which includes the wire bonding pads 23 and the bonding wires 25, seals and supports the light emitting element 20 and the lead frames 10, and includes a reflection hole 31 on an upper surface so that the light emission surface 21 is exposed to the exterior; and a lens part 40 included on the body part 30 and covering the light emitting element 20.
SONG YONG-HAE
HWANG SEONG DEOK
LEE SANG-HYUN
