PURPOSE: To prevent the fallout accident of a group of anode electrodes and to improve quality and reliability of a light emitting element by fixedly arranging a group of anode electrodes in the glass surface of the inner surface of a front panel directly with low-fusing-point glass to be fixed therein by firm and close holding.
CONSTITUTION: A fluorescent plane 5G, 5B, 5R, a carbon wiring film and an insulating film 15 are formed on the inner circumferential side of a front panel 2 constituting a vacuum envelope 1. The electrode fixing lead 16 of each accelerating electrode 61, 62... is bondingly arranged on the glass surface 2a of the front panel 2 exposed by cutting out each of the surfaces and a part of the film in the shape of a round with low-fusing-point glass 17. This bonding method includes the steps of bonding the lead 16 with the glass 17, and then baking it at a predetermined temperature to solidify, thereby firmly fixing the anode electrode group by bonding and then fixedly arranging it in the front panel 2. Thereby, an accident, such as fallout of an electrode group 6 can be eliminated to provide a high quality and reliable light emitting element.
| JP2718329 | SEMICONDUCTOR MOUNTING SUBSTRATE |
KIKUTA SHIGEKI
KAMIMURA SASHIRO
