PURPOSE: To enable exposure in short time with a small power lamp by moving parallel an optical system consisting of a reflecting mirror having a cylindrical surface for condensing light from a linear light source to a work system and a reflecting mirror for projecting perpendicularly the light thereby scanning the linear luminous flux on a wafer.
CONSTITUTION: This invention relates to a technique of subjecting a semiconductor wafer, etc. to a prescribed treatment by irradiating light thereto in which, if the invention is utilized for, for example, a contact aligner, etc., a wafer 2 is attracted and held to the top surface of a semiconductor wafer stage 1 and a mask 3 is held in proximity above said stage in such a way that the mask can be relatively moved in X-, Y-directions. On the other hand, an optical system consisting of a reflecting mirror 5 having a cylindrical surface for condensing the light from a linear light source 4 to the wafer 2 surface and plane reflecting mirros 6 and 7 is built into an outside frame body 8 shown by an alternate long and two short dashes broken line and these mirros more integrally like 8', 8" in a horizontal direction to conduct the linear condensed light from the mirror 7 onto the wafer 2 surface thereby scanning said light. Then the exposing light is the condensed luminous flux and therefore the exposure is accomplished in short time and the use of the small power light source is made possible.
KOMORIYA SUSUMU
NISHIZUKA HIROSHI
JP43029510A | ||||
JPS50766A | 1975-01-07 | |||
JPS4935453A | 1974-04-02 | |||
JPS5215266A | 1977-02-04 | |||
JPS5331975A | 1978-03-25 | |||
JP49146946B | ||||
JPS49110350A | 1974-10-21 |