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Patent Searching and Data


Title:
光源装置
Document Type and Number:
Japanese Patent JP7007560
Kind Code:
B2
Abstract:
There is provided a light source device comprising a substrate; a semiconductor laser placed on the substrate; a side wall portion formed so as to surround the semiconductor laser; and a cover being translucent, configured to cover a space surrounded by the substrate and the side wall portion, wherein the side wall portion includes a lower surface connected to an upper surface of the substrate over a whole periphery, an upper surface connected to a lower surface of the cover over a whole periphery, and inner side surfaces inclined so that the space expands from a lower surface side to an upper surface side of the side wall portion, at least a part of the inner side surfaces serving as a reflection surface for reflecting a beam emitted from the semiconductor laser toward the cover, and a connecting portion where an upper surface of the substrate and a lower surface of the side wall portion are in contact with each other via a connecting layer is provided in a region corresponding to an upper surface of the side wall portion in a plan view from above.

Inventors:
Miyata Tadaaki
Application Number:
JP2017188528A
Publication Date:
January 24, 2022
Filing Date:
September 28, 2017
Export Citation:
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Assignee:
Nichia Corporation
International Classes:
H01S5/02208; H01S5/02315; H01S5/0233
Domestic Patent References:
JP2004289106A
JP2006324658A
JP2005183558A
JP2014022530A
JP2004031708A
JP2011023421A
JP2007281061A
JP2010110809A
Foreign References:
US20080142829
US5761350
Attorney, Agent or Firm:
Mutsumi Samejima
Junichi
Yasuo Yanagibashi
Kojidate Shoji