Title:
LIGHTWEIGHT CLAY PUTTY
Document Type and Number:
Japanese Patent JP2011046821
Kind Code:
A
Abstract:
To solve such a problem wherein a polyester resin putty is difficult to apply thickly, and if forcibly applied, the shrinkage increases and the weight rises.
1 to 5 pts.mass of glass fibers cut into 1 to 10 mm and 30 to 70 pts.mass of hollow beads as a lightweight powder material are added to 100 pts.mass of an unsaturated polyester resin. Further, 1 to 6 pts.mass of a curing accelerator cobalt is added to form a base agent. 1 to 3 pts.mass of a hardener such as Permek to be used at use time of the base agent is added to 100 pts.mass of the unsaturated polyester resin contained in the base agent.
Inventors:
ISHIMURA TOSHIHIRO
Application Number:
JP2009196150A
Publication Date:
March 10, 2011
Filing Date:
August 27, 2009
Export Citation:
Assignee:
ISHIMURA TOSHIHIRO
International Classes:
C09D167/06; C08K3/08; C08K7/14; C08K7/22; C08L67/06; C09D5/34; C09D7/12; C09K3/10
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