Title:
LINEAR SOLDER
Document Type and Number:
Japanese Patent JP2023026821
Kind Code:
A
Abstract:
To provide a linear solder capable of shortening a processing time in a soldering process using a soldering device provided with an iron tip having a substantially cylindrical shape with a solder hole axially penetrating therethrough.SOLUTION: A linear solder is cut into a predetermined length and supplied into a solder hole axially penetrating through a cylindrical heatable iron tip, and has: a linear body portion 71 made of a solder alloy; and one or two or more flux portions 72a incorporated in the body portion 71 and continuous in an axial direction of the body portion 71. A sectional shape of the flux portion 72a, perpendicular to the axial direction of the body portion 71, is at least one of a circular shape, an arcuate shape, a semicircular shape, and an annular shape. If all the cross-sections of the one or two or more flux portions 72a have a circular shape, a central axis O1 of at least one of the flux portions 72a does not coincide with a central axis C of the body portion 71.SELECTED DRAWING: Figure 1
Inventors:
EBISAWA MITSUO
Application Number:
JP2021132206A
Publication Date:
March 01, 2023
Filing Date:
August 16, 2021
Export Citation:
Assignee:
AND CO LTD
International Classes:
B23K3/02; B23K35/14
Attorney, Agent or Firm:
Shigeki Yamada
Previous Patent: JPWO2023026820
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