Title:
連結印
Document Type and Number:
Japanese Patent JP7301301
Kind Code:
B2
Abstract:
To provide a connection stamp facilitating separating connected stamps in a connected state.SOLUTION: A connection stamp comprises: a rectangular parallelepiped-shaped stamp body 1 having a stamping face; a coupling projection 3 for connecting stamp bodies, formed on a surface 2a at the front side of a pair of facing surfaces orthogonal to the stamping face; an engaging groove formed on a surface 2b at the rear side of the surface formed with the coupling projection 3; and a release mechanism for releasing the connected stamp bodies. The release mechanism has a slider member 6 disposed on a stamp body lateral face and slidable toward the inside, and an extrusion member slidable in a direction orthogonal to a slide direction of the slider member 6. One side of a part in which the slider member 6 and the extrusion member come in contact is formed with an inclined plane for pushing up the extrusion member and projecting the upper end part from a stamp body surface when the slider member 6 is pushed into the inside.SELECTED DRAWING: Figure 1
Inventors:
Akitetsu Yasue
Daizaki Tomoya
Daizaki Tomoya
Application Number:
JP2019004051A
Publication Date:
July 03, 2023
Filing Date:
January 15, 2019
Export Citation:
Assignee:
Shachihata Co., Ltd.
International Classes:
B41K1/04
Domestic Patent References:
| JP5602490B2 | ||||
| JP2017077760A |
Foreign References:
| CN2843854Y |
Attorney, Agent or Firm:
Tatsuo Watanuki
Fumio Yamamoto
Keisuke Watanuki
Fumio Yamamoto
Keisuke Watanuki
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