PURPOSE: To make it possible to assure the thickness of conductive adhesives and to enhance the reliability of a liquid crystal display panel by providing a liquid crystal panel with spacers between an IC for driving and the IC packaging part of the liquid crystal panel.

CONSTITUTION: The spacers 8 having the height higher than the max. height of bumps 4 constituted at the IC 3 from the rear surface of the IC 3 are formed between the IC 3 and a glass substrate 1 on the IC packaging surface of the glass substrate 1. As a result, the layers of the conductive adhesives 5 are always assured in the spacings from the front ends of the bumps 4 to ITO films 7. The conductive adhesives 5 consisting of a thermosetting resin are applied on the bumps 4 and after the positions of the ITO films 7 and the conductive adhesives 5 are aligned, the IC 3 is brought near to the glass substrate 1, by which the adhesives 5 and the ITO films 7 are adhered. Curing is executed in this state within a high-temp. furnace. Thermal stresses are generated between the IC 3 and the glass substrate 1 by a difference in the coefft. of thermal expansion between both at the time of curing. The distortions by these thermal stresses are absorbed within the conductive adhesives 5.