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Title:
LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2008006812
Kind Code:
A
Abstract:

To hermetically seal more surely a gap between a back surface of a liquid discharge substrate and a front surface of a support member, and an electrode portion without adversely affecting discharge performance.

A first sealing resin 510 coats the support member 200 in "U shape" so as to surround the vicinity of both the tip ends of a liquid supply port 210. In addition, a liquid discharge substrate 400 is mounted over the first sealing resin 510, and electrically connected to an electrode pad 220 of the support member 200. Furthermore, a second sealing resin 520 coats the entire periphery of the liquid discharge substrate 400 on the support member 200.


Inventors:
KIYOTA KO
SAITO RIICHI
Application Number:
JP2007135420A
Publication Date:
January 17, 2008
Filing Date:
May 22, 2007
Export Citation:
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Assignee:
CANON KK
International Classes:
B41J2/16; B41J2/05
Domestic Patent References:
JP2006026950A2006-02-02
JP2006297827A2006-11-02
JP2003211678A2003-07-29
JP2004136683A2004-05-13
JP2004351754A2004-12-16
JP2001130001A2001-05-15
JP2000198208A2000-07-18
JP2007055071A2007-03-08
Attorney, Agent or Firm:
Akio Miyazaki
Ishibashi Masayuki
Masaaki Ogata