Title:
FORMAITON METHOD OF BUMP
Document Type and Number:
Japanese Patent JP3189402
Kind Code:
B2
Abstract:
PURPOSE: To provide a means wherein the scrap of a wire is hardly left on the surface of a bump and bumps whose height is even can be formed.
CONSTITUTION: The formation method is constituted of a process wherein a capillary 2 is lowered and a ball 3A is pressed to an electrode for a chip 8, of a process wherein the pressure force of the capillary 2 is read out and the capillary 2 is moved slightly to the transverse direction so as to climb over a wire swollen part on the surface of a bump, of a process wherein a pressure force is exerted on the capillary 2 and a wire 3 is pressed to the surface of the bump and of a process wherein the capillary 2 is raised, the wire 3 is clamped and pulled up by a clamper 35 and the wire 3 is cut from the root of a pressure point.
Inventors:
Kiyoshi Arita
Application Number:
JP20335492A
Publication Date:
July 16, 2001
Filing Date:
July 30, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Domestic Patent References:
| JP63304587A | ||||
| JP4130634A | ||||
| JP4146625A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)