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Title:
LIQUID PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2014183121
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus capable of cleansing a rear side of a substrate and a cup body in well.SOLUTION: A liquid processing apparatus comprises a spin chuck 11, around which a cup body 2 is provided, for rotating a wafer W to process the wafer with liquid. The liquid processing apparatus further comprises a cleaning material 3 supported around a vertical axis, and movable up and down against a cleaning nozzle 8. The cleaning material 3 is also rotatable at a position of cleaning the cup body 2. To clean a rear face of the wafer W, the cleaning material 3 is set at a first position, and cleaning liquid from the cleaning nozzle 8 is led through an opening 52 of the cleaning material 3 and reaches on the rear face of the wafer W. To clean the cup body 2, the cleaning material 3 is set at a second position higher than the first position, and cleaning liquid from the cleaning nozzle 8 is hit on an annular part 5 of the cleaning material 3 so as to be guided to an inside of the cup body 2. Accordingly, the rear face of the wafer W and the cup body 2 can be cleaned successfully.

Inventors:
KINOSHITA NAOFUMI
SAKAI YUJI
Application Number:
JP2013055605A
Publication Date:
September 29, 2014
Filing Date:
March 18, 2013
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; B05C11/08; B05C11/10; H01L21/304
Domestic Patent References:
JPH09117708A1997-05-06
JPH105668A1998-01-13
JPH05259060A1993-10-08
JPH1133468A1999-02-09
JPH0766116A1995-03-10
JPH0462831A1992-02-27
JPH08139007A1996-05-31
Attorney, Agent or Firm:
Toshio Inoue
Tomoaki Mitsuida