To provide a new liquid resin supply mechanism that can supply a constant amount of liquid resin to a mold with high reproducibility by properly processing stringing resin.

The liquid resin supply mechanism 1 discharges the liquid resin 200 downward from a nozzle 2 with a built-in gate valve 5, and supplies the liquid resin 200 to one of the molds. An outer peripheral air blowing port 3 for blowing air toward a nozzle tip end at the lower side is arranged at the outer periphery of the nozzle 2. A gate valve 5 is opened and the liquid resin 200 is discharged by a control signal from a control circuit 9. When finishing the discharge of the liquid resin 200, the gate valve 5 is closed and the control for blowing the air at the predetermined temperature from the outer peripheral air blowing port 3 is performed to maintain the liquid resin 200 in a liquid state.