To provide a liquid sealing resin composition preferable to seal a slim TAB for a LCD driver, which composition reduces the warpage of a sealed article without deteriorating workability, and improves the volume resistivity at high temperature and the adhesion with a tape.

(A) Epoxy resin consisting of dicyclopentadiene type epoxy resin and novolak type brominated epoxy resin, (B) dicyclopentadiene denatured phenol resin, (C) solvent naphtha or propylene glycol methyl ether acetate as a solvent, (D) internally cyclized type polybutadiene as a flexibility imparting agent, (E) fused silica an having average grain diameter of 1-20 μm, and (F) imidazol compound as a catalyst are essential components.