液処理装置及び液処理方法 - 東京エレクトロン株式会社

Title:

液処理装置及び液処理方法

Document Type and Number:

Japanese Patent JP4043455

Kind Code:

B2

Abstract:

The flow of a processing liquid poured onto the surface of a substrate at a standstill to process the substrate from the surface to the back surface of the substrate is suppressed to achieve satisfactory cleaning. When a processing liquid is poured onto a substrate held in a horizontal position by a substrate holding unit to carryout a predetermined process, for example, a cleaning liquid is discharged through a discharge opening corresponding to the entire circumference of the back surface of the substrate before pouring the processing liquid onto the surface of the substrate, and the cleaning liquid discharged on the back surface of the substrate and a liquid flowing from the surface to the back surface of the substrate are sucked through a suction opening corresponding to the entire circumference of the back surface of the substrate and included in a first suction means. Thus an outward flow of the cleaning liquid is produced on the back surface of the substrate. For example, the flow of the liquid from the surface to the back surface of the substrate can be suppressed without resorting to a shake-off action resulting from rotation and, consequently, the substrate can be satisfactorily cleaned.

Inventors:

Nishikido Shuichi

Application Number:

JP2004160078A

Publication Date:

February 06, 2008

Filing Date:

May 28, 2004

Export Citation:

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