Title:
LOCALIZED SOLDERING MACHINE UTILIZING STATE CHANGING MEDIUM
Document Type and Number:
Japanese Patent JP2530757
Kind Code:
B2
Abstract:
PURPOSE: To effectively execute the removing/attaching of the selected parts by utilizing a state changing medium and supporting an electronic circuit module to a work positioning mechanism.
CONSTITUTION: The selected fluid to a solder is poured into a vessel 11 and a cartridge type heating rod 12 is switched on. A quartz nozzle 27 matching to the parts to be removed, is selected and attached to localized soldering machine. During heating the fluid in the vessel 11, the electronic circuit module is laid on the work positioning mechanism 13 and adjusted so that the module comes to just below the nozzle 27. The quartz nozzle 27 is lowered by turning a knob 26 and covered on the parts to be removed. During operating a pedal type switch, the energy is supplied to the fluid from the cartridge type heating rod 12, and therefore, during developing reflow, vapor is continuously generated. The heat transfer from the vapor to a solder joining part is locally developed.
Inventors:
ANDORYUU ZACHARII GUROBATSUTOSUKII
ROBAATO JON RINCHI
JEEMUZU JOOJI MOTSUTAA JUNIAA
SUTEIIBU ANDORYUU REPUCHATSUKU
JEEN MARIE UITON
ROORENSU ROBAATO IETSUTAA
ROBAATO JON RINCHI
JEEMUZU JOOJI MOTSUTAA JUNIAA
SUTEIIBU ANDORYUU REPUCHATSUKU
JEEN MARIE UITON
ROORENSU ROBAATO IETSUTAA
Application Number:
JP3620791A
Publication Date:
September 04, 1996
Filing Date:
March 01, 1991
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
B23K1/015; B23K3/04; C07C23/44; H05K3/34; H05K13/04; B23K101/42; (IPC1-7): B23K1/015; B23K3/04; C07C23/44; H05K3/34
Domestic Patent References:
| JP3110062A | ||||
| JP60257970A | ||||
| JP60257971A | ||||
| JP354027B2 |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)