Title:
LOCATION OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JPS5996733
Kind Code:
A
Abstract:
PURPOSE:To improve the precision of the titled location by a method wherein the holes as locating marks are opened on a semiconductor wafer to be exposed by means of removing the resist coated on the semiconductor wafer for scanning the opened holes as locating marks by electronic beams. CONSTITUTION:The holes 12 as locating marks are opened on a semiconductor wafer 11. Then the wafer 11 is placed on a vacuum chuck 14 to be held as it is by means of vacuum attraction. When the semiconductor wafer 11 is coated with resist 13 in such a status, the resist 13 is removed passing through the opened holes 12 to open the communication holes 13a. Next the positions of the opened holes 12 are scanned by electronic beams 5 to align the positions of the semiconductor wafer 11 and the electronic beam source. Through these procedures, the titled location may be performed very accurately.
Inventors:
SHIGETOMI AKIRA
KATOU TADAO
KATOU TADAO
Application Number:
JP20705582A
Publication Date:
June 04, 1984
Filing Date:
November 24, 1982
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
G05D3/12; H01J37/304; H01L21/027; (IPC1-7): G05D3/00
Attorney, Agent or Firm:
Shinichi Kusano
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