Title:
メタロセンポリオレフィンをベースとする低活性化温度ヒートシールホットメルト接着剤
Document Type and Number:
Japanese Patent JP7114765
Kind Code:
B2
Abstract:
A low activation temperature heat seal hot melt adhesive for packaging applications based on a blend of metallocene catalyzed polyolefin polymer, tackifying resin, wax and other optional additives. In order to achieve the high viscosity suitable for an extrusion heat seal application, the adhesive composition of the invention is highly loaded with polymer, and thus should have a viscosity of about 50,000 centipoise or more measured at a temperature of 300° F. Accordingly, the hot melt adhesive composition contains about 50% to about 90% by weight of metallocene catalyzed polyolefin polymer, about 5% to about 50% by weight of tackifying resin, about 0.5% to about 40% by weight of wax, about 0.1% to about 5% by weight of a stabilizer or antioxidant, and 0% to about 25% by weight of optional additives. The hot melt adhesive composition must have an activation temperature of about 160° F. or less, and provide a minimum peel force of about 1.0 pound per inch in order to meet the sealing performance requirements for packaging food and other consumer goods.
Inventors:
Kanderski, Monina, Day.
Vitrano, Michael, Day.
Vitrano, Michael, Day.
Application Number:
JP2021023761A
Publication Date:
August 08, 2022
Filing Date:
February 17, 2021
Export Citation:
Assignee:
Bostik, Inc.
International Classes:
C09J123/08; B32B27/00; B32B27/32; B65D65/40; C09J11/06; C09J11/08
Domestic Patent References:
| JP2010195402A | ||||
| JP2017538806A | ||||
| JP2004284575A |
Foreign References:
| US20100256274 | ||||
| WO2014172179A1 | ||||
| KR1020110048074A | ||||
| WO2008099865A1 |
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Kamoto Takahashi
Nao Oda
Akiyo Iwahori
Kamoto Takahashi