Title:
低塗布温度ホットメルト接着剤
Document Type and Number:
Japanese Patent JP4782258
Kind Code:
B2
Abstract:
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170 DEG F; and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500.
Inventors:
Justin A. Mehaffee
Ingrid call
Ingrid call
Application Number:
JP2585399A
Publication Date:
September 28, 2011
Filing Date:
February 03, 1999
Export Citation:
Assignee:
HENKEL CORPORATION
International Classes:
C09J123/08; C09J125/02; C09J131/04; C09J193/04; C08L23/08; C08L25/16; C08L31/04; C08L91/06; C08L93/04
Domestic Patent References:
| JP7247468A | ||||
| JP2131997A | ||||
| JP58141226A | ||||
| JP57158276A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Kazuyuki Nishidate
Tetsuji Koga
Nagasaka Tomoyasu
Satoshi Deno
Akemi Hino
Toshio Toda
Masaya Nishiyama
Higuchi Souji
Takashi Ishida
Kazuyuki Nishidate
Tetsuji Koga
Nagasaka Tomoyasu
Satoshi Deno
Akemi Hino
Toshio Toda
Masaya Nishiyama
Higuchi Souji