Title:
LOW DEFORMATION ARAMIDE BOARD
Document Type and Number:
Japanese Patent JP2994156
Kind Code:
B2
Abstract:
PURPOSE: To provide an electric insulating heat-resistant aramide board reduced in the dimensional change due to moisture absorption and having good heat conductivity.
CONSTITUTION: A sheet (A) substantially consisting a m-aramide fibrid and a m-aramide fiber and a sheet (B) substantially consisting of the m-aramide fibrid, a p-aramide fiber and a glass fiber or granular mica are laminated after the moisture contents of both sheets are adjusted to below 5% so that at lease one layer of the sheet (A) is interposed between the respective layers of the sheet (B) and integrated under heating and pressure to obtain an aramide board.
Inventors:
Takanori Shinoki
Yamamoto Shiro
Yamamoto Shiro
Application Number:
JP29716592A
Publication Date:
December 27, 1999
Filing Date:
November 06, 1992
Export Citation:
Assignee:
Teijin Limited
International Classes:
B32B5/26; B32B27/34; C08K3/34; C08K7/02; C08K7/14; C08L77/00; C08L77/10; D21H13/26; D21H17/63; D21H27/30; H01B3/52; H05K1/03; (IPC1-7): B32B5/26; B32B27/34; H01B3/52
Attorney, Agent or Firm:
Maeda Junhiro