Title:
低誘電率熱伝導性放熱部材
Document Type and Number:
Japanese Patent JP7220150
Kind Code:
B2
Abstract:
Provided is a heat-dissipating member having excellent thermal conductivity and excellent dielectric properties and particularly suitable as a heat-dissipating member for electronic components. A heat-dissipating member in the form of a sheet having a thickness of 0.1 to 0.5 mm and comprising a resin composition, wherein the resin composition contains 60 to 70% by volume of a thermally conductive filler including an agglomerated powder of hexagonal boron nitride having an average particle size of 10 to 20 µm and an orientation index defined below of 2 to 20, and an aluminum oxide powder having an average particle size of 3 to 7 µm, and 30 to 40% by volume of a silicone resin. The orientation index is a ratio (I002/I100) of an intensity 1002 of a diffraction line on a (002) plane to an intensity I100 of a diffraction line on a (100) plane according to X-ray powder diffraction.
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Inventors:
Yamagata Toshiki
Kosuke Wada
Kaneko Masahide
Kosuke Wada
Kaneko Masahide
Application Number:
JP2019535653A
Publication Date:
February 09, 2023
Filing Date:
August 06, 2018
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
H01L23/36; B32B17/04; B32B27/00; B32B27/20; C08J5/18; C08K3/22; C08K3/28; C08L83/04; H01L23/373
Domestic Patent References:
| JP2014172768A | ||||
| JP2011144234A | ||||
| JP11026661A | ||||
| JP2011184507A |
Attorney, Agent or Firm:
Axis International Patent Attorney Corporation
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