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Title:
LOW-FOAMING ONE-PART MOISTURE CURING TYPE URETHANE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002363401
Kind Code:
A
Abstract:

To obtain a one-part moisture curing type urethane resin composition having a small amount of residual foam in a cured product and scarcely lowering adhesive strength.

This one-part moisture curing type urethane resin composition comprises 100 pts.vol. of a urethane prepolymer having isocyanate groups at both terminals and 500-2,000 pts.vol of a filler having 20-500 μm average particle diameter. A pumicious sand balloon, a glass balloon, a ceramic balloon ore silica sand is used as the filler. The one-part moisture curing type urethane resin composition is used as adhesives, sealants, coating materials coating agents, or the like. Thereby, in the one-part moisture curing type urethane resin composition. gaseous carbon dioxide produced during curing is released into the air. Accordingly, the amount of the residual foam in the cured urethane resin composition is small and adhesive strength is scarcely lowered.


Inventors:
OKAI KOJI
ARISAWA AKIZO
Application Number:
JP2001167947A
Publication Date:
December 18, 2002
Filing Date:
June 04, 2001
Export Citation:
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Assignee:
KONISHI CO LTD
International Classes:
C08L75/04; C08G18/10; C08K3/00; C09J175/04; (IPC1-7): C08L75/04; C08G18/10; C08K3/00; C09J175/04
Domestic Patent References:
JPH0999340A1997-04-15
JPS63186749A1988-08-02
JPH06172484A1994-06-21
JP2001139801A2001-05-22
JP2000034452A2000-02-02
JP2000313734A2000-11-14
Attorney, Agent or Firm:
Okumura Shigeki